Parts, Machinery and Tools (East Halls)

Hitachi Metals Ltd.

Silicon Nitride Substrate for Power Module
Having excellent strength and high thermal conductivity and silicon nitride substrate contribute to reduce size and improve the reliability of power module.
Hitachi Metals challenge to increase thermal conductivity compared to current silicon nitride using key technology based on impurity control, decreasing defect and crystalline control.

• PREV
• NEXT